Usually there are two ways to rework the process in the package to remove silica gel, each method corresponding challenges faced. First method is to soak the silicone solvent such as xylene, to swelling and softening of silica gel, and then re-use mechanical means to remove. The risk of this approach is that: As the microelectronic packaging constitutes a very complex and compact structure, it may damage the package substrate and packaging structures. In addition, this approach may also be difficult to remove residual silica in the substrate surface. Digestion using silicon or surfactant is another of the more common method, silicon digestion / emulsifier is formed by the weak acid or base, which makes silicon-oxygen bond breaks, the curing of the silicone polymer body is divided into separate poly silicon siloxane molecules. Use of silicone emulsion method largely avoids the use of mechanical removal methods, thereby reducing the potential damage to the device and reduce the silica gel residue in the substrate.